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3D printed electronics that fold themselves into “origami” shapes as they cool

MIT and Amherst material science researchers have published a paper in ACS Applied Material & Interfaces that describes an untouched-by-human-hands method for making self-folding circuits with a 3D printer; the materials are laid down precisely so that as it cools, differential rates of contraction cause it to bend into dimensional forms that are ready for use in a finished device.
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